This paper describes several new epoxy adhesives and bonding processes specifically developed for high volume, low cost automotive assembly operations. The applications include halogen-quartz headlamps; assembly of a variety of under-the-hood electrical and electronic components; a one component epoxy body solder used since 1971 to replace lead in the exposed body joints of taxicabs and other vehicles; and low temperature curing, flexible epoxy adhesives used to increase the strength of steel body joints of school buses and other “rivet bonded” structures.


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    Title :

    Epoxy Adhesives for Automotive Assembly Operations


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    1980 Automotive Engineering Congress and Exposition ; 1980



    Publication date :

    1980-02-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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