This presentation provides an overview of the NEPP Program as well as the current roadmap for NEPP tasks.


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    Title :

    The NASA Electronic Parts and Packaging (NEPP) Program: Overview and Roadmap for FY16


    Contributors:

    Conference:

    Microelectronics Reliability and Qualification Working Meeting ; 2016 ; El Segundo, CA, United States
    HiREV Industry Day ; 2016 ; El Segundo, CA, United States


    Publication date :

    2016-02-09


    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English