A novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes.


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    Title :

    Integrated Avionics System (IAS), integrating 3-D technology on a spacecraft panel


    Contributors:

    Conference:

    IEEE Aerospace Conference


    Publication date :

    2002-03-09


    Type of media :

    Conference paper


    Type of material :

    No indication


    Language :

    English