Integrated circuit fabrication technology has evolved to the point that it is possible to construct complete systems, including power, data processing, and communications, on a single chip. Such System-on-a-chip (SOAC) technologies can enable drastic reductions in spacecraft size and weight, lowering the cost of missions and presenting new mission opportunities. This paper overviews some key enabling technologies unique to the needs of spacecraft for outer-planet exploration and missions requiring extreme resistance to radiation such as Europa orbiters and Europa Landers. The work is being carried out by Kansas State University (KSU) under direction of the Center for Integrated Space Microsystems (CISM) at NASA's Jet Propulsion Laboratory. Additional information is contained in the original extended abstract.


    Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Title :

    Electrically Isolating Subsystems in SOAC Technologies


    Contributors:


    Publication date :

    2001-01-01


    Type of media :

    Conference paper


    Type of material :

    No indication


    Language :

    English




    Satellite Ozone Analysis (SOAC/DMSP)

    Luther, F. M. / Ellis, J. S. / Lovill, J. E. et al. | NTRS | 1980


    Electrically-Isolating Analog Amplifier

    Paulkovich, John / Rodriguez, G. Ernest | NTRS | 1988


    Electrically Isolating Transmission-Line Driver

    Marchman, Robert H. | NTRS | 1992



    Converter including an electrically isolating and thermally conductive layer

    WALTRICH UWE / BUCHERT STANLEY / BOHLLÄNDER MARCO et al. | European Patent Office | 2023

    Free access