The results of a study carried out in order to manufacture and verify the quality of chip-on-board (COB) packaging technology are presented. The COB, designed for space applications, was tested under environmental stresses, temperature cycling, and temperature-humidity-bias. Both robustness in space applications and in environmental protection on the ground-complete reliability without hermeticity were searched for. The epoxy-parylene combinations proved to be superior to other materials tested.


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    Title :

    Fabrication and Qualification of Coated Chip-on-Board Technology for Miniaturized Space Systems


    Contributors:
    Maurer, R. H. (author) / Le, B. Q. (author) / Nhan, E. (author) / Lew, A. L. (author) / Darrin, M. Ann Garrison (author)

    Conference:

    ESA Electronic Components Conference ; 1997 ; Noordwijk, Netherlands


    Publication date :

    1997-07-01


    Type of media :

    Conference paper


    Type of material :

    No indication


    Language :

    English




    Fabrication and Qualification of Coated Chip-on-Board Technology for Miniaturised Space Systems

    Maurer, R. H. / Garrison Darrin, M. A. / Le, B. Q. et al. | British Library Online Contents | 1997


    Fabrication and Qualification of Coated Chip-on-Board Technology for Miniaturised Space Systems

    Maurer, R. H. / Garrison Darrin, M. A. / Le, B. Q. et al. | British Library Conference Proceedings | 1997




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