The results of a study carried out in order to manufacture and verify the quality of chip-on-board (COB) packaging technology are presented. The COB, designed for space applications, was tested under environmental stresses, temperature cycling, and temperature-humidity-bias. Both robustness in space applications and in environmental protection on the ground-complete reliability without hermeticity were searched for. The epoxy-parylene combinations proved to be superior to other materials tested.
Fabrication and Qualification of Coated Chip-on-Board Technology for Miniaturized Space Systems
ESA Electronic Components Conference ; 1997 ; Noordwijk, Netherlands
1997-07-01
Conference paper
No indication
English
Fabrication and Qualification of Coated Chip-on-Board Technology for Miniaturised Space Systems
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