New nondestructive in-situ electromagnetic-impedance measurement technique senses cure-processing properties of high-temperature, high-performance thermostat and thermoplastic resins. Continuous frequency-dependent measurement and analysis performed during curing cycle. Monitors and measures molecular properties of polymeric resin in liquid and solid states. Applications include nondestructive means for evaluation of materials, determination of "window" boundaries of curing cycles of thermoplastics and thermoset resins, and for online, closed-loop control of curing cycles.
Monitoring Polymer Curing Via Electromagnetic Impedance
NASA Tech Briefs ; 16 , 8
1992-08-01
Miscellaneous
No indication
English
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