Thermal-expansion properties modified to prevent bonds from failing. Proposed transition layer deposited between substrate and strain or temperature gauge to be bonded to substrate. Intended particularly for gauges that must operate at temperatures above 600 degrees F (320 degrees C) and substrates like fiber-reinforced carbon/carbon composites. Reduces stress caused by difference between thermal expansions of gauge and substrate materials. Without transition layer, stress often weakens or breaks bond.
Bonding Gauges To Carbon/Carbon Composites
NASA Tech Briefs ; 13 , 9
1989-09-01
Miscellaneous
No indication
English
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