Attachment for reciprocating power-saw maintains nearly constant cutting pressure even though kerf length varies. Attachment developed for wire saws used to slice cylindrical silicon ingots into wafers for semiconductor devices. By maintaining constant pressure, attachment helps to ensure smooth, flat, uniform wafers. Principle adaptable to straight, toothed saws as well as to wire saws.


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    Title :

    Constant-Pressure Sawing


    Contributors:

    Published in:

    Publication date :

    1986-01-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English


    Keywords :


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