Optical instrument accurately records unformed lead offset for each flatpack and provides better fit of flatpack to printed wiring board.


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    Title :

    Selecting Flatpack Lead-Forming Dies


    Contributors:

    Published in:

    Publication date :

    1985-01-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English


    Keywords :


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