20-page report reviews methods available for etching specific layers on wafers and discusses automation techniques and features on one particular automated system. Compares two major etching methods, chemical (wet) and plasma (dry), and discusses areas in need of development. Methods covered include "dip-and-dunk" manual method of chemical etching, automated chemical etching, and plasma etching.


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    Title :

    Etching Integrated Circuits


    Contributors:

    Published in:

    Publication date :

    1983-03-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English