Hard crystalline materials such as lithium fluoride (LiF) are cleaved in thin sections by semiautomatic machine. Yield of undistorted LiF crystals is almost 100 percent, even when cleaved section is only 1/32 inch thick. Machine contains spring-activated hammer that limits penetration of blade and controls shock that cleaves crystal. Fixture with spring-loaded clamps precisely locates and holds crystal, restraining it in ideal position for cleaving. Crystal then splays apart.


    Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Title :

    Cleaving machine for hard crystals


    Contributors:

    Published in:

    Publication date :

    1981-01-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English


    Keywords :


    Simple Room Temperature Method for Polymer Optical Fibre Cleaving

    Sáez-Rodríguez, David / Nielsen, Kristian / Bang, Ole et al. | British Library Online Contents | 2015


    Analytical Model for CW-Laser Cleaving of Semiconductors (M305)

    Schutz, V. / Haupt, O. / Kling, R. et al. | British Library Conference Proceedings | 2009


    Laser Cleaving of Glass Fibers and Glass Fiber Arrays

    Van Steenberge, G. / Geerinck, P. / Van Put, S. et al. | British Library Online Contents | 2005


    Nonperipheral epilayer cleaving of GaAs for hybrid device applications

    Fujita, J. / Levy, M. / Osgood, R. M. et al. | British Library Conference Proceedings | 1998


    Simple Room Temperature Method for Polymer Optical Fibre Cleaving

    Sáez-Rodríguez, David / Nielsen, Kristian / Bang, Ole et al. | British Library Online Contents | 2015