Conducting layer prevents static charges from accumulating during implantation of silicon-on-sapphire MOS structures. Either thick conducting film or thinner film transparent to ions is deposited prior to implantation, and gaps are etched in regions to be doped. Grounding path eliminates charge flow that damages film or cracks sapphire wafer. Prevention of charge buildup by simultaneously exposing structure to opposite charges requires equipment modifications less practical and more expensive than deposition of conducting layer.
More-reliable SOS ion implantations
NASA Tech Briefs ; 5 , 2
1980-09-01
Miscellaneous
No indication
English
DOSSIER <> - Calcia: la compétitivité des ports conditionne les implantations industrielles.
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