A review of the thermal design options for unmanned Shuttle payloads is presented. Because many future Shuttle payloads will have budgets and less time available for the definition of their thermal subsystems, simplified design procedures will be the most cost-effective. The thermal interface between an individual payload and the Orbiter is discussed. A simplified, modular thermal control system that will reduce the cost of providing thermal protection by minimizing both the initial procurement cost of any specialized hardware and the need for a detailed thermal interface analysis is described.
An assessment of thermal design procedures for Shuttle payloads
1978-10-01
Conference paper
No indication
English
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