The two most important display driver interconnect technology candidates for military and avionic AMLCD are tape automated bonding (TAB), and flip chip on glass (FCOG). These two technologies will be reviewed and compared in detail. The topics presented include: maturity of the respective technologies; infrastructure differences; known good die issues; FCOG layout issues; processing and run rate issues; reliability considerations; and FCOG rework issues.
Display driver interconnect technology for military and avionic AMLCD
1996-01-01
521444 byte
Conference paper
Electronic Resource
English
Display Driver Interconnect Technology for Military and Avionic AMLCD
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