The two most important display driver interconnect technology candidates for military and avionic AMLCD are tape automated bonding (TAB), and flip chip on glass (FCOG). These two technologies will be reviewed and compared in detail. The topics presented include: maturity of the respective technologies; infrastructure differences; known good die issues; FCOG layout issues; processing and run rate issues; reliability considerations; and FCOG rework issues.


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    Title :

    Display driver interconnect technology for military and avionic AMLCD


    Contributors:


    Publication date :

    1996-01-01


    Size :

    521444 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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