Plastic Encapsulated Microelectronics (PEMs) components are used increasing numbers in military applications. Influencing factors are improving reliability, greater availability and Federal initiatives for use. This discussion focuses on efforts to introduce plastic encapsulated microcircuits to a highly complex, highly integrated military product. The emphasis is on reliability testing of these components. Reliability testing of PEM's for military applications has been somewhat limited in "high-end" devices and packages. This discussion focuses on testing of a wide range of die sizes including large die (/spl ges/0.5" per side), and a wide range of packages, including large packages (up to 2"/spl times/2" per side) for both custom and off-the-shelf commercial packages.


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    Title :

    ASIC/MCM and microcircuit testing using commercial practices


    Contributors:
    Miller, M. (author) / Myers, M. (author)


    Publication date :

    1996-01-01


    Size :

    549493 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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