We have successfully fabricated several batches of open-hole buried heterostructure (BH) lasers using self-align technique with a hole of about 3 /spl mu/m opening. This new processing technology have in the active region, a traditional buried heterostructure (BH) with semiinsulating InP which works as a current block material. While in the passive region, the semiinsulating InP is the waveguide cladding material. The proposed method is very important for integrated photonic devices. Using this method we will be able to develop sophisticated photonic circuits with very good performance for future optical networking applications.
A new open-hole buried heterostructure process for the fabrication of photonic integrated circuits
The 16th Annual Meeting of the IEEE Lasers and Electro-Optics Society, 2003. LEOS 2003. ; 2 ; 1028-1029 vol.2
2003-01-01
181843 byte
Conference paper
Electronic Resource
English
A New Open-Hole Buried Heterostructure Process for the Fabrication of Photonic Integrated Circuits
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