Aiming at high forces at low space in linear direct drives, favorable heat transfer conditions and high copper filling factors of the coils are of central importance [1]. For this reasons coils are mainly made of round copper wire and subsequently casted with impregnating resins or epoxy resins to increase stability and thermal conductivity. However, there are alternatives such as coils with rectangular wire, casted coils [2] or PCB (printed circuit boards) coils [3]. Due to the geometric design of linear direct drives PCB coils can be an alternative [4]. In this paper a coil in printed circuit board design is presented. The development and the process, from the selection of suitable PCB designs to optimization, assembly and comparison with conventionally round wire coils, is described. A linear direct drive is designed to compare the force-displacement characteristics and the increase of the temperature in static operation of the two types of coils. Slightly lower temperature of the overall system at the same mechanical motor parameters can be achieved with the PCB coil.


    Access

    Check access

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Design of Printed Circuit Board Coils for Precision Engineering Linear Direct Drives


    Contributors:


    Publication date :

    2018-12-01


    Size :

    1154746 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



    High acceleration and high precision laser-cutting with linear direct drives

    Rudlaff,T. / Zentrum Fertigungstechnik,Stuttgart,DE | Automotive engineering | 1993


    93LA013 High Acceleration and High Precision Laser-Cutting with Linear Direct Drives

    Rudlaff, T. / ISATA / ENEA; Agency: Italy | British Library Conference Proceedings | 1993


    Printed Circuit Board Coils of Multitrack Litz Structure for 3.3-kW Inductive Power Transfer System

    Narvaez, Alexis / Carretero, Claudio / Lope, Ignacio et al. | IEEE | 2023



    Printed circuit board

    SATO KENTA / JEONG HEEWON | European Patent Office | 2021

    Free access