As inductive wireless power transfer reaches higher power levels; thermal management becomes essential. To address these concerns, past works have demonstrated the benefit of encapsulating coil assemblies with thermally conductive materials and integrating backside liquid cooling into coil assemblies. This work adds to these developments by considering the thermal analysis and construction of a liquid-cooled high power polyphase wireless power transfer ground assembly intended for long duration operation at high power levels, aiming towards hundreds of kW or even 1 MW.


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    Title :

    Thermal Integration of a High Power Polyphase Inductive Coil Assembly


    Contributors:
    Foote, Andrew (author) / Asa, Erdem (author) / Onar, Omer (author)


    Publication date :

    2024-06-19


    Size :

    1891518 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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