Optimizations and improvements of the newly developed micro-multilayer multifunctional electrical insulation (MMEI) system were continued. While its dielectric strength was maximized with material-design-process enhancement and optimizations, reaching 91% increase over the Kapton® PI film alone, the efforts of implementing multifunctionality into the system were also advanced. Significant progresses have been made in scaling up the MMEI structures and assessing their commercial applicability and manufacturability in full-scale 3-dimensional prototypes of electrical components, such as power cables and bus bars. Systematic dielectric breakdown property characterizations including the effects of test environment, oil vs. air, and corona resistance of the SOA insulation materials and MMEI structures have been successfully carried out with 2-dimensional coupons and 3-dimensional power cables. An optimum MMEI structure was selected for the initial full-scale prototype development based on the extensive property and performance database of the MMEI and the SOA functional materials. Work has been also continued to identify controlling mechanisms or theories for the major improvement in dielectric strength of the MMEI structures. This paper discusses current progress and advancement on the developed MMEI structure summarized above.
Development of High Voltage Micro-Multilayer Multifunctional Electrical Insulation (MMEI) System
2019-08-01
4750781 byte
Conference paper
Electronic Resource
English
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