Temperature cycling for more than 300 cycles and for temperatures down to - 175°C performed on soldered silicon cell assemblies with copper, Kovar, and molybdenum interconnectors showed a wide range in failures depending both upon the materials used and on interconnector thickness and substrate material. The solder fatigue failure rate is strongly dependent on stress level in agreement with analytical predictions.
Temperature Cycling Effects on Solar Panels
IEEE Transactions on Aerospace and Electronic Systems ; AES-5 , 6 ; 943-950
1969-11-01
2632068 byte
Article (Journal)
Electronic Resource
English
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