This paper presents the Butt-coupled silicon optoelectronic modules for high-speed optical interconnects. The optoelectronic (OE) modules is populated by flip-chip bonding either with VCSELs or detectors placed in direct contact with the waveguides without additional optical elements. The light is guided through the Si module by integrated waveguides based on holes etched through the silicon, which are then oxidized and filled with a polymer. This integrated OE module concept requires only one alignment step in the board and is compatible with a multi-layer waveguide approach. Data transmission of up to 5 Gbps has been demonstrated.


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    Title :

    Butt-coupled optoelectronic modules for high-speed optical interconnects


    Contributors:
    Dellmann, L. (author) / Lamprecht, T. (author) / Oggioni, S. (author) / Witzig, M. (author) / Dangel, R. (author) / Beyeler, R. (author) / Berger, C. (author) / Horst, F. (author) / Offrein, B.J. (author)


    Publication date :

    2005-01-01


    Size :

    726282 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English




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