This paper investigates several methods for substrate removal and sample mounting. In comparing mounting methods and processing techniques, it is found that indium solder used in conjunction with substrate removal is effective for heat extraction from VECSELs material. Future use of CVD diamond should improve heat transfer due to its superior thermal conductivity.


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    Title :

    Heat dissipation for high power optically pumped semiconductor vertical external cavity surface emitting lasers


    Contributors:
    Li Fan, (author) / Schillgalies, M. (author) / Fallahi, M. (author) / Nelson, T.R. (author) / Ehret, J.E. (author) / Agresta, D.L. (author) / Moloney, J. (author) / Hader, J. (author) / Zakharian, A. (author)


    Publication date :

    2003-01-01


    Size :

    133471 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English