In this article, the basics of optical fiber-chip-coupling theory are discussed and a series of modules for one-sided and double-sided fiber-chip coupling of waveguide-fed InP and GaAs OEICs like diode lasers, semiconductor amplifiers and optical modulators are presented. Simultaneous coupling of the fiber to both chip sides is possible. The modules are temperature controlled within an ambient temperature range from -10/spl deg/C to +50/spl deg/C and electrical modulation signals up to 50 GHz can be fed via RF connectors to the OEIC. The fiber-chip coupling method with our reconfigurable mechanical set-up shows very high mechanical resolution of better than 0.3 /spl mu/m, while the coupling loss is typically less then 3 dB with commercial lensed fibers. The package shows good long-term stability and is well suited for rapid prototyping and small-scale production.


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    Title :

    Photonic packaging for optical communications systems-basics and applications


    Contributors:


    Publication date :

    2005-01-01


    Size :

    827791 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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