g-Pack is a low-frequency packaging approach to breadboarding of silicon photonics chips. It provides optical i/o through a fiber array coupled to gratings couplers, and multiple DC i/o through a pin grid array (PGA) carrier.


    Access

    Download


    Export, share and cite



    Title :

    g-Pack - a generic testbed package for silicon photonics devices


    Contributors:
    Zimmermann, L. (author) / Schröder, H. (author) / Tekin, T. (author) / Bogaerts, W. (author) / Dumon, P. (author)

    Conference:

    2008


    Publication date :

    2008


    Size :

    3 pages



    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English