A communication module, according to one embodiment of the present invention, comprises: a substrate; a first chipset embedded within the substrate; a shielding layer disposed between the first chipset and a second chipset; a ground layer connected to the shielding layer and disposed on the bottom of the substrate; and a first via connecting the shielding layer and the ground layer.

    Un module de communication, selon un mode de réalisation de la présente invention, comprend : un substrat ; un premier jeu de puces intégré à l'intérieur du substrat ; une couche de blindage disposée entre le premier jeu de puces et un second jeu de puces ; une couche de masse connectée à la couche de blindage et disposée sur le fond du substrat ; et un premier trou d'interconnexion connectant la couche de blindage et la couche de masse.

    본 발명의 일 실시예에 따른 통신모듈은 기판, 상기 기판 내에 임베디드되는 제1 칩셋, 상기 제1 칩셋과 제2 칩셋 사이에 배치되는 차폐층, 상기 차폐층과 연결되고 상기 기판의 하부에 배치된 접지층, 및 상기 차폐층과 상기 접지층을 연결하는 제1 비아를 포함한다.


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    Title :

    COMMUNICATION MODULE


    Additional title:

    MODULE DE COMMUNICATION
    통신모듈


    Contributors:

    Publication date :

    2024-07-04


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Korean


    Classification :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60K Anordnung oder Einbau von Antriebseinheiten oder von Kraft- bzw. Drehmomentübertragungen in Fahrzeugen , ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen



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