A microelectronic component arrangement includes a sensor and a carrier. The sensor has a detection surface and a region including contact elements situated at a first distance with respect to one another. The carrier includes a mounting surface, and the sensor is fixed on the carrier by the contact elements situated at a first distance with respect to one another at least regionally. The detection surface is opposite the mounting surface in a manner having a second distance with respect to the mounting surface. The contact elements are wetted by a mechanically stabilizing material, the region including the contact elements is enclosed by the mechanically stabilizing material, and the detection surface is free of the mechanically stabilizing material.
Microelectronic component arrangement and production method for a microelectronic component arrangement
2018-03-20
Patent
Electronic Resource
English
IPC: | B64C AEROPLANES , Flugzeuge / B81B Mikrostrukturbauelemente oder -systeme, z.B. mikromechanische Bauelemente , MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES / B81C Verfahren oder Geräte besonders ausgebildet zur Herstellung oder Behandlung von Mikrostrukturbauelementen oder -systemen , PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS |
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