This bonded structure includes a first member having a metal portion and a film portion disposed on at least a part of a surface of the metal portion; a second member; an adhesive layer for joining the first member and the second member to each other via the film portion. The film portion contains a resin and inorganic particles. The inorganic particles are formed of ferrosilicon or non-oxide ceramics containing V. Some of the inorganic particles protrude toward the adhesive layer. The particle size of at least some of the inorganic particles protruding toward the adhesive layer is less than the film thickness of the film portion.
ADHESIVELY JOINED STRUCTURE AND COMPONENT FOR VEHICLE
2021-12-16
Patent
Electronic Resource
English
Debonding of adhesively joined electronic circuits for recycling
Online Contents | 1993
|Nondestructive Evaluation of Adhesively-Joined Aluminum Alloy Sheets Using an Ultrasonic Array
SAE Technical Papers | 2015
|