An assembly for mounting an electronics package to a tire includes an electronics package, a mount with a peripheral flange, and an attachment patch. The electronics package is connected to the mount, which is in contact with the tire. The attachment patch is connected to the mount and includes a central opening that it smaller than the peripheral flange. The attachment patch is further affixed to the tire.
ATTACHMENT MECHANISM FOR TIRE-MOUNTED SENSORS
2021-04-01
Patent
Electronic Resource
English