A physical quantity sensor includes a movable body, a support portion supporting the movable body through a connecting portion, and a substrate that is disposed so as to overlap the movable body in plan view and provided with a first fixed electrode and a second fixed electrode along a first direction orthogonal to a longitudinal direction of the connecting portion. In plan view, a dummy electrode that is disposed next to the first fixed electrode and is at the same potential as the movable body is provided on the substrate. The first fixed electrode and the dummy electrode includes a first electrode material layer provided on the substrate, and a second electrode material layer provided on the substrate and on the first electrode material layer. The second electrode material layer constituting the first fixed electrode and the second electrode material layer constituting the dummy electrode are provided between the first electrode material layer constituting the first fixed electrode and the first electrode material layer constituting the dummy electrode, in plan view. A distance between the second electrode material layer constituting the first fixed electrode and the second electrode material layer constituting the dummy electrode is smaller than a distance between the first electrode material layer constituting the first fixed electrode and the first electrode material layer constituting the dummy electrode, in plan view.
PHYSICAL QUANTITY SENSOR MANUFACTURING METHOD, PHYSICAL QUANTITY SENSOR, ELECTRONIC DEVICE, AND VEHICLE
2021-03-18
Patent
Electronic Resource
English
IPC: | B81C Verfahren oder Geräte besonders ausgebildet zur Herstellung oder Behandlung von Mikrostrukturbauelementen oder -systemen , PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / B81B Mikrostrukturbauelemente oder -systeme, z.B. mikromechanische Bauelemente , MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES / G01P MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION OR SHOCK , Messen der Linear- oder Winkelgeschwindigkeit, der Beschleunigung, der Verzögerung oder des Stoßes |
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