A heat exchanger for aircraft electronic components includes a first plate having channels arranged with side-by-side channel inlets fed from a common fluid supply manifold extending to the channel inlets from a manifold inlet. The channel inlets include a first set of inlets spaced further away from the manifold inlet than a second set of inlets. The fluid supply manifold has a flow divider positioned fluidly between the manifold inlet and the channel inlets. The flow divider is configured in use to direct heat exchange fluid entering the manifold from the manifold inlet preferentially toward the first set of inlets. A second plate is coupled with the first plate to seal the channels and the fluid supply manifold.
PLATE COOLER FOR AIRCRAFT ELECTRONIC COMPONENTS
2021-02-04
Patent
Electronic Resource
English