An electrical conveyance assembly includes a substrate that may include an electrically insulating material. The electrical conveyance assembly may include a plurality of electrical conductors connected to the substrate via additive manufacturing. The substrate may include an internal lattice structure formed via additive manufacturing. The substrate may include an internal fluid channel.
ELECTRICAL CONVEYANCE ASSEMBLY
2020-12-03
Patent
Electronic Resource
English
IPC: | H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B64D Ausrüstung für Flugzeuge , EQUIPMENT FOR FITTING IN OR TO AIRCRAFT / G06K Erkennen von Daten , RECOGNITION OF DATA / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES |