A power module apparatus (10) comprises: a power module (100A) comprising a package (110) configured to seal a perimeter of a semiconductor device, and a heat radiator (42) bonded to one surface of the package; a cooling device (30) comprising a coolant passage (33) through which coolant water flows, in which the heat radiator is attached to an opening (35) provided on a way of the coolant passage, wherein the heat radiator (42) of the power module (100A) is attached to the opening (35) of the cooling device (30) so that a height (ha) and a height (hb) are substantially identical to each other. The power module in which the heat radiator is attached to the opening formed at the upper surface portion of the cooling device can also be efficiently cooled, and thereby it becomes possible to reduce degradation due to overheating.
POWER MODULE APPARATUS, COOLING STRUCTURE, AND ELECTRIC VEHICLE OR HYBRID ELECTRIC VEHICLE
2019-11-07
Patent
Electronic Resource
English
IPC: | H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60K Anordnung oder Einbau von Antriebseinheiten oder von Kraft- bzw. Drehmomentübertragungen in Fahrzeugen , ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES / F28F Einzelheiten von Wärmetauschern oder Wärmeübertragungsvorrichtungen für allgemeine Verwendung , DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION / H02M APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS , Anlagen zur Umformung von Wechselstrom in Wechselstrom, von Wechselstrom in Gleichstrom oder umgekehrt, oder von Gleichstrom in Gleichstrom und zur Verwendung in Netzen oder ähnlichen Stromversorgungssystemen / H05K PRINTED CIRCUITS , Gedruckte Schaltungen |
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