An electronic component module includes a housing and a substrate which is configured to be housed in the housing. The substrate has a substrate side part which extends straight in a housing direction to the housing and which is configured to be guided to the housing when the substrate is housed. The housing has a substrate guide part which is configured to guide the substrate side part when the substrate is housed, a housing side wall on which the substrate guide part is formed, and a locked part which is formed to be continuous to an outer surface of the housing side wall and which is locked to an attachment destination.
ELECTRONIC COMPONENT MODULE, ELECTRIC CONNECTION BOX, AND WIRE HARNESS
2019-09-26
Patent
Electronic Resource
English
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