A conductive portion of a circuit body is formed by performing spraying on a surface of a resin casing. For spraying of the conductive portion, a cold spray method in which metal powder and inert gas are sprayed to an object is used. A circuit component is mounted on the conductive portion. Each terminal portion of the conductive portion is provided with a connector for connection with an external circuit body. An insulating resin is laminated on a surface of the conductive portion. The circuit body is directly formed on the surface of the resin casing by a series of processes described above.
METHOD OF FORMING CIRCUIT BODY AND CIRCUIT BODY
2019-09-05
Patent
Electronic Resource
English
CIRCUIT BODY, MANUFACTURING METHOD OF CIRCUIT BODY, AND MANUFACTURING APPARATUS OF CIRCUIT BODY
European Patent Office | 2018
|CIRCUIT BODY ARRANGEMENT STRUCTURE AND VEHICULAR CIRCUIT BODY
European Patent Office | 2019
|