A bond fixture for bonding a component includes a frame defining a chamber for receiving the component. A first pad and a second pad are mounted to the frame. At least one of the first pad and the second pad is movable relative to the frame to adjust a pressure applied to the component. A caul assembly is adapted to be disposed in thermal communication with the component. The caul assembly heats a localized portion of the component.
BOND FIXTURE FOR COMPOSITE SPLICE CAP ASSEMBLY
2019-08-08
Patent
Electronic Resource
English