An electronics assembly comprising at least one circuit board substrate comprising a fluid inlet channel and a fluid outlet channel and at least one heat generating component coupled to the circuit board substrate. The at least one heat generating component is fluidly coupled to the fluid inlet channel and the fluid outlet channel. A heat exchanger is directly coupled to the circuit board substrate and comprises an inlet plenum fluidly coupled to the fluid outlet channel of the circuit board substrate and an outlet plenum fluidly coupled to the inlet channel of the circuit board substrate. A pump is fluidly coupled to the circuit board substrate and the heat exchanger.
COOLING ASSEMBLIES FOR COOLING HEAT GENERATING COMPONENTS AND VEHICLES AND ELECTRONICS ASSEMBLIES INCORPORATING THE SAME
2019-04-18
Patent
Electronic Resource
English
European Patent Office | 2019
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