An ablative material comprises a phenolic resin, a polymeric phosphorylated amide, and a number of fillers. The polymeric phosphorylated amide is in the ratio of between 1 and 10 parts of the polymeric phosphorylated amide per 100 parts of phenolic resin or resin solids, by weight.
Ablative Material with a Polymeric Phosphorylated Amide
2018-09-06
Patent
Electronic Resource
English
IPC: | C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS , Massen auf Basis makromolekularer Verbindungen / B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM , Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse / B64G Raumfahrt , COSMONAUTICS |
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