A placement base (100) of a semiconductor device (90) comprises a body (10) on which the semiconductor device (90) is disposed, and a fixing unit (40) for fixing the semiconductor device (90) to the body (10). The body (10) has a supporting unit (12) and a bottom surface (11) placed in an inner periphery of the supporting unit (12) and placed lower than the supporting unit (12). A difference in height ΔH between the supporting unit (12) and the bottom surface (11) is larger than a sum (H1+H2) of a calculated or measured maximum upward warp H1 of the bottom surface (11) and a calculated or measured maximum downward warp H2 of a base of the semiconductor device (90).
PLACEMENT BASE FOR SEMICONDUCTOR DEVICE AND VEHICLE EQUIPMENT
2018-01-11
Patent
Electronic Resource
English
Placement base for semiconductor device and vehicle equipment
European Patent Office | 2018
|Application icon placement method and device, electronic equipment and vehicle
European Patent Office | 2023
|