An embedded power module includes a substrate, first and second semiconducting dies, first and second gates, and first and second vias. The first semiconducting die is embedded in the substrate and spaced between opposite first and second surfaces of the substrate. The second semiconducting die is embedded in the substrate, is spaced between the first and second surfaces, and is spaced from the first semiconducting die. The first gate is located on the first surface. The second gate is located on the second surface. The first via is electrically engaged to the first gate and the second semiconducting die, and the second via is electrically engaged to the second gate and the first semiconducting die.


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    Title :

    EMBEDDED POWER MODULE


    Contributors:

    Publication date :

    2018-01-11


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    B66B Aufzüge , ELEVATORS / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen



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