A metal mold that is used has a penetration hole in which a wiring bundle is to be penetratingly disposed, an annular retention portion-molding space for surrounding the outer circumference of the wiring bundle, and an engagement portion-molding space communicatively connected with the retention portion-molding space. The wiring bundle is disposed in the penetration hole, a melt resin is poured in the retention portion-molding space from the engagement portion-molding space, and solidified through cooling to mold a retention portion integrally with a engagement portion in a state of being closely adhered to an outer circumference of the wiring bundle.
METHOD FOR MANUFACTURING WIRE HARNESS, WIRE HARNESS MANUFACTURING DEVICE, WIRE HARNESS, AND RETENTION COMPONENT
2016-09-29
Patent
Electronic Resource
English
IPC: | B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL , Verfahren zum Aufbringen von Flüssigkeiten oder von anderen fließfähigen Stoffen auf Oberflächen allgemein / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR |
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