A heat shield assembly is disclosed. In various embodiments, the heat shield assembly defines a first circumferential side and a second circumferential side and an inboard end and an outboard end and includes a first layer defining a first surface of the heat shield assembly and having a first tab member disposed proximate the inboard end at the first circumferential side and a second tab member disposed proximate the outboard end at the first circumferential side; and a second layer defining a second surface of the heat shield assembly and having one or more first crimped portions extending along the first circumferential side and configured to engage the first tab member and the second tab member.


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    Title :

    Segmented heat shield with reduced interlayer thermal conduction


    Contributors:
    LEIVA ORLY (author)

    Publication date :

    2023-02-07


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    B64C AEROPLANES , Flugzeuge / B60B VEHICLE WHEELS , Räder für Fahrzeuge



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