A thermal interface member configured to be disposed between a heat sink and a heat-releasing device includes a thermal interface member. The thermal interface member has a thermally conductive, cure-in-place, polymer foam pad configured to maintain uniform contact with each of the heat sink and the heat-releasing device. The thermal interface member is additionally configured to absorb the thermal energy released by the heat-releasing device and direct the released thermal energy to the heat sink. The polymer foam pad has a matrix structure including at least one of anisotropic and isotropic thermally conductive anisotropic filler material, and is characterized by foam material density below 0.5 g/cm3.


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    Title :

    Cure-in-place lightweight thermally-conductive interface


    Contributors:

    Publication date :

    2022-07-26


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    H01M Verfahren oder Mittel, z.B. Batterien, für die direkte Umwandlung von chemischer in elektrische Energie , PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY / B60K Anordnung oder Einbau von Antriebseinheiten oder von Kraft- bzw. Drehmomentübertragungen in Fahrzeugen , ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen / F28F Einzelheiten von Wärmetauschern oder Wärmeübertragungsvorrichtungen für allgemeine Verwendung , DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION



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