A damping cover for an integrated power electronics module (IPEM), the damping cover generally defined by a top side and a bottom side, wherein the bottom side is configured to mate adjacent with or contiguous to a power inverter module (PIM) of the IPEM. The damping cover can include an aluminum foam core including a top surface generally corresponding to the top side of the damping cover and a bottom surface generally corresponding to the bottom side of the damping cover and a polymeric over-molding or non-porous aluminum outer layer covering the top surface and/or a polymeric over-molding or non-porous aluminum outer layer covering the bottom surface. The bottom side of the damping cover can mate adjacent with or contiguous to the PIM. The polymeric material over-molding can completely impregnate the aluminum foam core. The aluminum foam core can have a density of about 0.15 g/cm3 to about 1.0 g/cm3.


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    Title :

    Damping covers for power inverter modules and integrated power electronics modules utilizing the same


    Contributors:
    WANG QIGUI (author) / HE SONG (author) / PACK SEONGCHAN (author) / WILLIS ANGELA P (author)

    Publication date :

    2021-09-07


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM , Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / G10K Tonerzeugungsvorrichtungen , SOUND-PRODUCING DEVICES



    DAMPING COVERS FOR POWER INVERTER MODULES AND INTEGRATED POWER ELECTRONICS MODULES UTILIZING THE SAME

    WANG QIGUI / HE SONG / PACK SEONGCHAN et al. | European Patent Office | 2021

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