Disclosed is a vehicle air-conditioning device using semiconductor as a cooling core, including a thermoelectric cooling chip, a cooling circulator, a heat dissipation device, and a power-supplying and temperature-controlling device. The thermoelectric cooling chip has an electricity receiving end electrically connected to the power-supplying and temperature-controlling device to receive electricity therefrom to be energized as to have an end thereof forming a cold generating surface adjacent to the cooling circulator and an end opposite to the cold generating surface forming a heat generating surface adjacent to the heat dissipation device. The cooling circulator includes a tube-winding circulation box including temperature-reduction conducting fins distributed on a surface, a temperature-receiving water tank, a temperature-receiving conducting plate, a fan, and an assistive temperature transferring device including an electric water pump. The tube-winding circulation box is connected through piping to the temperature-receiving water tank that is stacked with the temperature-receiving conducting plate.


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    Title :

    Vehicle air-conditioning device using semiconductor as cooling core


    Contributors:

    Publication date :

    2021-09-07


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    B60H ARRANGEMENTS OR ADAPTATIONS OF HEATING, COOLING, VENTILATING, OR OTHER AIR-TREATING DEVICES SPECIALLY FOR PASSENGER OR GOODS SPACES OF VEHICLES , Anordnung oder Einbau der Heizung, Kühlung, Lüftung oder anderer Luftbehandlungsvorrichtungen für die Fahrzeugräume für Reisende oder Fracht



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