Passively deployable thermal management devices, systems, and methods are provided in accordance with various embodiments. For example, some embodiments include a passively deployable radiator device that may include: one or more thermally conductive layers; and/or one or more strain energy components configured to deploy passively the one or more thermally conductive layers. The one or more thermally conductive layers may include one or more carbon layers. The one or more carbon layers may include at least one or more graphite layers or one or more graphene layers. At least the one or more graphite layers or the one or more graphene layers include at least one or more pyrolytic graphite sheets or one or more pyrolytic graphene sheets.


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    Title :

    Passively deployable thermal management devices, systems, and methods


    Contributors:
    FRANCIS WILLIAM (author) / HULSE MICHAEL (author) / ISAACS STEVEN (author) / LAKE MARK (author) / SHOUKAS GREG (author) / TURSE DANA (author) / SALDANA MARIO (author)

    Publication date :

    2021-07-20


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    F28F Einzelheiten von Wärmetauschern oder Wärmeübertragungsvorrichtungen für allgemeine Verwendung , DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION / B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM , Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse / B64C AEROPLANES , Flugzeuge / B64G Raumfahrt , COSMONAUTICS / F28D Wärmetauscher, soweit in keiner anderen Unterklasse vorgesehen, in denen die Wärmetauschmittel nicht in direkte Berührung miteinander kommen , HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES



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