A capacitor module that suppresses the occurrence of solder cracking includes a substrate having a first principal surface and a second principal surface opposite to each other in a thickness direction, and capacitor elements mounted on at least the first principal surface of the substrate, wherein the substrate has a first pad electrode solder-bonded to a first terminal electrode provided at one end side of the capacitor elements and a second pad electrode solder-bonded to a second terminal electrode provided at the other end side of the capacitor elements, and penetrating holes are provided at positions, which overlap a pair of boundary lines that define a boundary between at least a region between the first pad electrode and the second pad electrode and an outside of the region in a plan view, and pass through the substrate in the thickness direction.
Capacitor module, resonator, wireless power transmission device, wireless power reception device, and wireless power transmission system
2020-12-29
Patent
Electronic Resource
English
IPC: | H01G Kondensatoren , CAPACITORS / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen / H02J CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER , Schaltungsanordnungen oder Systeme für die Abgabe oder Verteilung elektrischer Leistung / H03H IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS , Scheinwiderstandsnetzwerke, z.B. Resonanzkreise / H05K PRINTED CIRCUITS , Gedruckte Schaltungen |
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