The present disclosure relates to electronic devices and configurations. In one embodiment, an electronic device includes a plurality of circuit boards and a plurality of chassis enclosures. Each of the plurality of circuit boards is separately housed by a chassis enclosure. Each chassis enclosure includes a front housing and a back housing, the front housing and back housing configured to retain a circuit board, and at least one heat dissipation element. The plurality of chassis enclosures are mounted to provide an air gap for heat dissipation between each chassis enclosures. Each chassis enclosure electrically shields a retained circuit board.


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    Title :

    Modular electronic device and head unit for vehicles


    Contributors:
    JIA DAVID (author) / NOSHADI VALOD (author) / GARZA HOMERO (author) / TZINARES ALEX (author)

    Publication date :

    2019-04-30


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60K Anordnung oder Einbau von Antriebseinheiten oder von Kraft- bzw. Drehmomentübertragungen in Fahrzeugen , ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES



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