A package which comprises a chip carrier, at least one electronic chip mounted on the chip carrier, an electrically conductive contact structure electrically coupled with the at least one electronic chip, and a mold-type encapsulant encapsulating part of the electrically conductive contact structure, and at least part of the chip carrier and of the at least one electronic chip, wherein the chip carrier comprises a thermally conductive and electrically insulating core covered on both opposing main surfaces thereof by a respective brazed electrically conductive layer.
Molded package with chip carrier comprising brazed electrically conductive layers
2018-09-11
Patent
Electronic Resource
English
Molded package with chip carrier comprising brazed electrically conductive layers
European Patent Office | 2019
|Molded package with chip carrier comprising brazed electrically conductive layers
European Patent Office | 2019
|HEATABLE MOLDED ARTICLES MADE FROM ELECTRICALLY CONDUCTIVE THERMOPLASTIC POLYURETHANE
European Patent Office | 2016
|ELECTROCHROMIC MULTI-LAYER DEVICES WITH COMPOSITE ELECTRICALLY CONDUCTIVE LAYERS
European Patent Office | 2022
|