A mold transfer apparatus includes: a lift unit including a first frame; a first loading unit connected to the lift unit; and a second loading unit connected to the lift unit, wherein the first frame is vertically movable. Therefore, the mold transfer apparatus can transfer a mold onto first, second and third floor structures of the loading unit.

    본 발명은 제1 프레임을 포함하는 리프트 유닛; 상기 리프트 유닛에 연결되는 제1 적재 유닛; 및 상기 리프트 유닛에 연결되는 제2 적재 유닛을 포함한다. 상기 제1 프레임은 상하로 이동 가능하다.


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    Title :

    Mold Transfer Apparatus


    Additional title:

    금형 이송 장치


    Contributors:
    KIM KI HWAN (author)

    Publication date :

    2021-01-06


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Korean


    Classification :

    IPC:    B66F HOISTING, LIFTING, HAULING, OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD , Hub-, Verhol- oder Schubvorrichtungen, soweit nicht anderweitig vorgesehen, z.B. Vorrichtungen mit unmittelbarer Krafteinwirkung auf die Last / B65G TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS , Transport- oder Lagervorrichtungen, z.B. Förderer zum Laden oder Abladen



    Mold Transfer Apparatus

    KIM KI HWAN | European Patent Office | 2021

    Free access

    Mold Transfer Apparatus

    KIM KI HWAN | European Patent Office | 2021

    Free access

    Mold Transfer Apparatus

    European Patent Office | 2021

    Free access

    Mold Transfer Apparatus

    European Patent Office | 2021

    Free access

    Mold Transfer Apparatus

    European Patent Office | 2021

    Free access