A junction block is provided. The junction block includes a pcb having a core layer formed inside an insulating layer on which a circuit pattern is formed; a heat dissipation tray connected to one side of the pcb and extended outwardly; a jumper pin connecting the core layer and the heat dissipation tray; a lower case accommodating the pcb; and an upper case covering the lower case. The heat dissipation tray includes a fixing part fixed to one side of the pcb and connected to the core layer; a heat dissipation part protruding to the outside of the upper case; a connection part connecting the fixing part and the heat dissipation part; and a rigid panel disposed between the pcb and the fixing part and having a second through hole through which the jumper pin passes. The durability of the junction block can be more improved by dissipating the heat of the core layer to the outside to lower the temperature in the junction block.

    회로 패턴이 형성된 절연층의 내부에 코어층이 형성된 pcb; 상기 pcb의 일 측에 연결되고, 연장되어 외측으로 형성되는 방열 트레이; 상기 코어층과 상기 방열 트레이를 연결하는 점퍼핀; 상기 pcb를 수용하는 로우어케이스; 및 상기 로우어케이스를 덮는 어퍼케이스;를 포함하고, 상기 방열 트레이는 상기 pcb의 일 측에 고정되어 상기 코어층과 연결되는 고정부; 상기 어퍼케이스의 외부로 돌출 형성되는 방열부; 상기 고정부와 상기 방열부를 연결하는 연결부; 및 상기 pcb와 상기 고정부 사이에 배치 고정되고, 상기 점퍼핀이 관통하는 제2 관통홀이 형성된 리지드 패널;를 포함하여, 코어층의 열을 외부로 방출하여 정션블록 내의 온도를 낮춰 내구성이 보다 향상된 정션블록을 제공한다.


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    Title :

    JUNCTION BLOCK WITH HEAT DISSIPATION STRUCTURE


    Additional title:

    방열구조가 구비된 정션블록


    Contributors:
    YEOM JIN SU (author) / LEE DA BEEN (author)

    Publication date :

    2019-12-04


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Korean


    Classification :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



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